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Chassis
-Full Tower
-Mid Tower
-Desktop
- Mini Case
-BTX
-Misc.
 
Power Supply
- Toughpower
- PurePower
- TR2 Power
- Litepower
- Misc.
 
Liquid Cooling
System
- DIY L.C.S
- All-in-One L.C.S
- Upgrade
 
Cooler
- Retail Cooler
- TMG Cooler
- TR2 Value Cooler
- Chipset/Memory/VGA
- H.D. Cooling
- Combo Cooling
- Notebook Cooling
 
DC Fan
- LED Fan
- VR Control
- Combo
- Standard
- UV
- Mobile
- Slot Fan
 
Storage
- 2.5" Solutions
- 3.5" Solutions
- 5.25" Solutions
- LAN / RAID
- Accessories
 
Accessory
- Keyboard/Mouse Pad
- Drive Bay
- Grease
- Case Mods
 


Patent Information
Country Patent No.
Taiwan
M302742
D119775
EU
000691514-0002
China
ZL 2006 2 0164729.3

 
Copper Construction ~ 6 radial copper heatpipes penetrated fins with mirror coating copper base
Extreme Silence and Maximum Cooling
Patented Radiate Heatsink Design
 
 
 
A. Fast heat transfer by 6 Heatpipes
B. Heat is conducted evenly by radiate circle fins.
C. Surrounding fins dissipate heat greatly by sidle fan air flow.
 
-
Embedded fan dissipates heat away from both surrounding fins and immediate fins so as to enhance cooling
-
Larger cooling area not just provides CPU cooling but VRM cooling.
 
 
  6 Copper Heatpipes   VR Control
   
 
  Mirror Coating Copper Base   Blue LED Light
   
Application View
Packing
High Quality Thermal Grease
 
 




* Specifications are subject to change without notice.
* The product picture(s) is only for your reference, it may differ from the actual product.


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"Tt", Thermaltake, Thermaltake are trademarks of Thermaltake Technology Co., Ltd.
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