Chassis
Power Supply
Liquid Cooling System
Cooler
DC Fan
Storage
Accessory
Kandalf
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Patent Information

Patent Information
Country
Patent No.
Taiwan
D 104565
China
ZL 2004 3 0053969.2
U.S.A.
US D505,426 S
Germany
4 04 03 507.8
Air Cooling System
liquid Cooling System
 
Fanless System
 
Innovation Design- Compatible with ATX and BTX
Inside Structure
Specification
Model VA9000BWS
Case Type Super Tower
Dimension (H x W x D) 530 x 220 x 560 mm (H*W*D)
Net Weight 18.1Kg
Side Panel Transparent side panel
Color Black
Material -Chassis: 1.0mm SECC
-Front Bezel: Aluminum
Cooling System -Front (intake) : 120x120x25 mm, 1300rpm, 17dBA
-Rear (exhaust) : 120 x 120 x25 mm blue LED fan, 1300rpm, 17dBA
90 x 90 x 25mm, 1800rpm, 19dBA
-Top (exhaust) : 90 x 90 x 25mm, 1800rpm, 19dBA
Drive Bays -Front Accessible 10 x 5.25", 2 x 3.5"
-Internal 6 x3.5"
Expansion Slots 7
Motherboards Micro ATX, ATX, Extend ATX, BTX

BTX Upgrade Kits SRM / Rear plate (optional)
Drive Bay Kits
-Relocate-able HDD & FDD rack
-3 x 3.5" HDD module with 12cm LED fan
-Accessory box

* Specifications are subject to change without notice.
* The product picture(s) is only for your reference, it may differ from the actual product.
"Tt", Thermaltake, Thermaltake are trademarks of Thermaltake Technology Co., Ltd. All other registered trademarks belong to their respective companies.