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Patent Information |
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Country |
Patent No. |
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Taiwan |
M 292738 |
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Universal application for all memory modules. The standard size fits on all motherboards.
- An artful Integration of Liquid cooling and air cooler
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Aluminum heatsink dissipates the heat generated from the chipset more efficiently.
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Copper tubing transfers the heat to the liquid cooling system immediately.
- User Friendly
Quick Install Connector saves you time and energy.