-*Clip for new Intel® Core™ i7 processor available (Optional)
Users can utilize the socket LGA1366 upgrade kit without buying a new cooler
- Best performance, supports up to TDP 130W.
-
Heatsink:
-
6 heatpipes, maximized heat transfer.
- High density of
aluminum fins, provides large surface for heat dissipation.
-
Seamless soldering process and
large copper base provide good contact for heat conductivity
- Waved fins to reduce wind shear noise.
-
3 in 1 application
-
For LGA775: push pin design for faster install.
-
For K8 and latest socket AM2, tool-less clip, easy to install.
-
VR Fan
- Silent and powerful VR fan,
16dBA at minimum fan speed.
-
Adjustable fan control to boost cooling performance.